Founded in 2023, the company is a national high-tech enterprise focusing on the research and development of semiconductor packaging and testing equipment and precision automation equipment. Our product direction is a series of high-end packaging and testing equipment such as high-precision wire bonding machines in semiconductor process equipment and its upstream and downstream patch, testing, etc., to create a national industrial chain of semiconductor packaging and testing equipment, break the blockade of foreign countries on semiconductor fine manufacturing process equipment, and strive to become the mainstay of domestic semiconductor process equipment!
The core technical personnel of our team are from the Singapore R&D Center of ASMPT, the world's largest semiconductor packaging and testing equipment company, who has been engaged in the research and development and design of semiconductor process equipment for more than 20 years, and senior engineers who have been engaged in software development and hardware design in this field for a long time in China, as well as professional and technical personnel such as FPGA system application engineers, with rich practical experience and solid theoretical foundation.
At present, the company's main R&D products include ball-wedge integrated multifunctional bonding machine, fully automatic ultrasonic aluminum wire wedge welding machine, fully automatic deep cavity ball wire bonding machine and fully automatic wafer ball implanting machine, etc., which are mainly used in integrated circuits, discrete devices, optical communication devices, laser devices, microwave components, sensors, IGBT high-power devices and other fields.
Starting from wire bonding and guided by the national extremely large-scale integrated circuit manufacturing technology and equipment policies, Foanxin strives to develop into a first-class supplier of high-end semiconductor process equipment at home and abroad.