How does the ball-wedge integrated multifunctional bonding machine ensure the reliable performance of the solder joints during the bonding process?
Publish Time: 2025-03-20
The ball-wedge integrated multifunctional bonding machine has adopted a variety of advanced technologies and designs to ensure the reliable performance of the solder joints during the bonding process.1. Equipment functions and design advantagesBall bonding and wedge bonding function switching: The ball-wedge integrated multifunctional bonding machine can easily switch between ball bonding and wedge bonding, which adapts to the needs of different types of bonding. Whether it is a spherical bonding that requires the formation of solder balls or a wedge bonding that directly welds the leads to the chip pads, the equipment can do it.Fully closed-loop pressure control and force compensation algorithm: The equipment adopts a fully closed-loop pressure control system, combined with a force compensation algorithm, which can achieve precise control of the bonding force. This helps to maintain stable pressure during the bonding process, thereby ensuring the quality of the solder joints.DSP phase-locking technology: Through DSP phase-locking technology, the equipment can output stable ultrasonic energy and has multiple ultrasonic power settings. This helps to ensure the quality of the solder joints, because stable ultrasonic energy is one of the key factors for achieving good bonding.Precise ball burning time and current control process: The equipment provides precise ball burning time and current control process, which helps to form high-quality solder balls during ball bonding. Good solder ball quality is the basis for ensuring the reliability of solder joints.2. Bonding parameter optimizationBonding pressure: Bonding pressure is one of the key factors affecting solder joint quality. In wedge bonding, appropriate bonding pressure can ensure close contact between the lead and the pad, thereby achieving good electrical connection. In ball bonding, excessive bonding pressure may cause the solder ball to be flattened, affecting the strength of the lead. Therefore, the equipment is usually equipped with a pressure adjustment function to adapt to different bonding requirements.Bonding time: Bonding time is also an important factor affecting the quality of solder joints. Too short bonding time may cause the solder joint to not be fully cured, while too long bonding time may cause the solder joint to overheat or be damaged. Therefore, the equipment usually has an adjustable bonding time setting to ensure the reliability of the solder joint.Ultrasonic power: Ultrasonic power plays a vital role in the bonding process. It helps promote atomic diffusion and plastic deformation between the lead and the pad, thereby achieving good bonding. However, excessive ultrasonic power may cause the wire to be directly broken or the film layer on the surface of the pad to be damaged. Therefore, the equipment is usually equipped with an ultrasonic power adjustment function to adapt to pads of different materials and thicknesses.3. Material adaptabilitySupport for a variety of lead materials: ball-wedge integrated multifunctional bonding machine can support the bonding of various types of leads such as gold wire, platinum wire, copper wire, silver wire, aluminum wire, gold ribbon, etc. This helps to meet the needs of different application scenarios and ensure the reliability of solder joints.Adapt to pads of different materials and thicknesses: The equipment can adapt to pads of different materials and thicknesses, including gold-plated pads, aluminum pads, etc. This helps to ensure good bonding in all situations.4. Reinforcement treatment and quality controlReinforcement treatment: For ball bonding, especially in application scenarios with large vibration, the equipment usually reinforces the second solder joint, such as ball reinforcement or glue reinforcement. This helps increase the reliability of the lead and prevents the wire from detaching during transportation or vibration testing.Quality monitoring and feedback: The equipment is usually equipped with a quality monitoring system that can monitor and feedback key parameters in the bonding process in real time. This helps to detect potential problems in time and take corresponding measures to adjust, thereby ensuring the reliability of the solder joints.In summary, the ball-wedge integrated multifunctional bonding machine ensures the reliable performance of the solder joints during the bonding process through advanced equipment functions and design advantages, optimized bonding parameters, a wide range of material adaptability, and reinforcement treatment and quality control measures.
