Founded in 2023, the company is a national high-tech enterprise focusing on the research and development of semiconductor packaging and testing equipment and precision automation equipment. Our product direction is a series of high-end packaging and testing equipment such as high-precision wire bonding machines in semiconductor process equipment and its upstream and downstream patch, testing, etc., to create a national industrial chain of semiconductor packaging and testing equipment, break the blockade of foreign countries on semiconductor fine manufacturing process equipment, and strive to become the mainstay of domestic semiconductor process equipment!
    The core technical personnel of our team are from the Singapore R&D Center of ASMPT, the world's largest semiconductor packaging and testing equipment company, who has been engaged in the research and development and design of semiconductor process equipment for more than 20 yea....