Our Services Category

FA6600 Series

Ball-Wedge Integrated Multifunctional Bonding Machine

Ball-Wedge Integrated Multifunctional Bonding Machine

FA6600
Pre-sales business and technical communication, after-sales guidance installation and equipment operation process training.
FA6600 series is a multifunctional wire bonding equipment, which is used to connect the pads on the chip and the pads on the lead frame with gold wire or aluminum wire. It is one of the key equipment in the semiconductor production packaging process.

Consult

Features Technical Indicators Overall Dimension

Figure 1: Bonding application

Figure 2: Operating handle

The handle button can be pressed short to skip the solder joint, and long to lock the XY and Z axis functions.
The all-electric drive mode does not require compressed air, which simplifies the operation and maintenance of the equipment.
Advantages:
1. Closed-loop pressure control system: accurately control the bonding force during the bonding process to reduce the influence of human factors.
2. DSP phase-locked technology: stable ultrasonic power output, fully meeting high-quality requirements such as the bonding of microwave components.
3. Ball planting and zero-line tail control: greatly meet the needs of optical communication devices for soft substrates and fine wire bonding.
4. Flat four-structure design: makes it easy to handle laser devices that require deep cavity large module bonding.
5. FPGA ignition control: improve the response speed and stability of the equipment.
6. Touch screen interface: convenient for users to adjust parameters and operate the equipment, and supports multi-language adaptation.
7. False trigger suppression: real-time Z-axis motion second-order differential algorithm to avoid false triggering and ensure the smooth progress of normal bonding.
Application areas: Discrete devices, laser devices, optoelectronic modules, microwave devices, optical communication devices, sensors, high-power devices, etc.

Input voltage: 220V AC±10%.
Power: ≤500W.
Frequency: 50Hz - 60Hz.
FA6600 series multifunctional bonding machine dimensions: left and right length is 580mm, front and back depth is 630mm, height is 320mm (excluding microscope), and the whole machine weighs about 45kg.

Wire diameter	Gold wire: 15 ~ 75μm
	Aluminum wire: 18 ~ 100μm
	Platinum wire: 18um ~ 25um
	Silver wire: 18 ~ 50um
	Gold ribbon: 50um×12.5um ~ 300um×25.4um
Device height	31mm or 51mm (19mm length splitter)
Type of riving knife	Φ1/16 19mm, 21mm, 25mm wedge welding splitter
Type of riving knife	Φ1/16 16mm, 19mm ball welding splitter
Welding pressure	1 ~ 250g, 1g subdivision adjustable
Ultrasonic power	0 ~ 5W, 5mW subdivision adjustable
Bonding time	0 ~ 1 second, 1 millisecond subdivision adjustable
Locking method	Fully electric control, no compressed air required
Welding head Z-axis travel	18mm
Welding head horizontal movement range	15mm×15mm
Wire clamp wire feeding travel	Max. 800um
Wire feeding method	90° (deep cavity) or 45°
Operating table	Liftable height: 18mm
Operating table	Workbench area: 270mm×250mm
Wire feeding device	1/2″ or 2″ spool, optional
Human-machine interface	7-inch LCD touch screen with a resolution of 1024*600 and multiple sets of buttons
Working hot table	3″ standard hot workbench, customizable